Unique Process for Creating Extensible Displays
and Extensible Printed Circuit Substrates
RFT-249
Scientists at North Dakota State University have developed a unique via-to-pad soldering method that allows the creation of extensible displays and extensible printed circuit substrates. The invention describes a method for securely connecting thin strips of material to create flexible substrates of virtually any dimension.
Downloads
File: rft-249.pdf
Inquiries
Jonathan L. Tolstedt
Licensing Associate/Patent Agent
NDSU Research Foundation
1735 NDSU Research Park Drive, Suite 124
Fargo, North Dakota 58105-5002
(701) 231-8173 Work
(701) 231-6661 Fax
www.ndsuresearchfoundation.org